Cooperation Partners

1. BTU Cottbus
2. Center for Microtechnologies Chemnitz
3. Fraunhofer Micro Materials Center Berlin
4. University of Dayton, Ohio, USA
5. Infineon AG Munich and Dresden
6. Technical University Berlin
7. FH Augsburg
8. University of Vienna
9. Amitronics GmbH Seefeld, Munich
10. FH Zwickau
11. Institute for Polymer Research, Merseburg
12. Image Instruments GmbH Chemnitz
13. CWM GmbH Chemnitz
14. Conti Temic microelectronic GmbH Nuremberg
15. Fraunhofer IZFP, Dresden branch
16. AMIC GmbH Berlin
17. Ing.-Bureau Luczak Berlin
18. Fraunhofer Microelectronics Alliance Berlin
19. HTW Mittweida
20. Beckmann-Institute Lichtenstein
21. InnoMat GmbH Teltow
22. Technical University Dresden
23. EUCEMAN European Center for Micro- and Nanoreliability
24. TeSiMat - InnoProfile research group, Berlin
25. VDI/VDE Innovation + Technik, Berlin
26. Forschungszentrum Karlsruhe
27. FlexJet: EPCOS München (Leitung), W.C. Heraeus Hanau, Fraunhofer IFAM Bremen, Infineon Technologies Neubiberg, Microdrop Technologies Norderstedt, Mühlbauer Oberhaching, TU Berlin, Vermes Technik Otterfing
28. Restles: Continental Teves Frankfurt/Main (Leitung), Sensitec Lahnau, Fraunhofer IZM Berlin, AEMtec Berlin, Uni des Saarlands Saarbrücken, Uni Freiburg.
29. NanoPack: Thales Research&Technology Paris (Leitung), Bosch Stuttgart, Chalmers Univ. Göteborg, Electrovac Klosterneuburg, FOAB Electronic Hisings Backa, Fraunhofer IZM Berlin, IBM Research Rüschlikon, ICN Bellaterra, IEMN Lille, MicReD Budapest, THALES Avionics Paris, Univ. Budapest, VTT Espoo.